CN/EN

产品与市场

Autolad4G

特点

● 无铅兼容
● 高Tg无卤,Tg 190℃ (DMA)
● UV阻挡功能,AOI兼容
● 优异的HDI可靠性,适合mSAP工艺

应用领域

● 车载ADAS
● 车载摄像头模组
● 车载数据中心
● 车载计算单元等
  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg 2.4.24 TMA 170
2.4.24.2 DMA 190
Td 2.4.24.6 TGA(5% wt.loss) 390
T288
2.4.24.1 TMA min >60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24c Before Tg ppm/℃ 30
After Tg ppm/℃
190
50-260℃ % 2.1
CTE (X/Y-axis) 2.4.24.5 Before Tg
ppm/℃
12/13
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50, RC75% - 3.38
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50, RC75%
- 0.0072
Volume Resistivity 2.5.17.1 After moisture resistance MΩ.cm 3.87×109
E-24/125
MΩ.cm
5.66×108
Surface Resistivity
2.5.17.1
After moisture resistance
1.72×107
E-24/125
5.19×106
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 182
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength
2.4.8
288℃/10s, Hoz N/mm
0.95
125℃, Hoz N/mm 0.90
Flexural Strength (LW/CW)
2.4.4
A GPa
28/27
Water Absorption 2.6.2.1 D-24/23 % 0.06
Flammability
UL94
C-48/23/50,E-24/125
Rating
V-0

Remarks:

Remarks:  1. Specification sheet: IPC-4101/130, is for yourreference only.

2. All the typical value listed aboveis for your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co., Ltd.