产品与市场
S7045GX
特点
● 较低的X/Y轴热膨胀系数（≤13ppm）
● 高Tg伴随较好的热可靠性
● 卓越的耐CAF失效表现
● 无卤无铅
应用领域
● 服务器、通讯基站- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 190 | |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% wt. loss) | ℃ | 450 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
| Thermal Stress | IPC-TM-659 2.4.13.1 | 288℃, solder dipping | s | ＞300 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 20 | |
| After Tg | ppm/℃ | 130 | |||
| 50-260℃ | % | 1.30 | |||
| CTE (X/Y-axis) | IPC-TM-650 2.4.24.1 | Before Tg | ppm/℃ | 12.5 | |
| Permittivity | IPC-TM-650 2.5.5.9 | C-24/23/50, 1GHz | - | 4.04 | |
| IPC-TM-650 2.5.5.5 | C-24/23/50, 10GHz | - | 4.23 | ||
| Loss Tangent | IPC-TM-650 2.5.5.9 | C-24/23/50, 1GHz | - | 0.0031 | |
| IPC-TM-650 2.5.5.5 | C-24/23/50, 10GHz | - | 0.0063 | ||
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 2.6x10^8 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 3.6x10^8 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 185 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 |
D-48/50+D-0.5/23 |
KV | ＞45 | |
| Peel Strength (1oz RTF) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.70 [4.0] | |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.09 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
Remarks:
1. Dielectric Constant and Dissipation Factor typical value is based on the 0.508mm (4X2116) specimen. Other typical value is based on the 1.524mm (12X2116) specimen.
2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.