CN/EN

产品与市场

WLM1

特点

●  无铅兼容材料

Mini-LED背光用白色材料

●  热老化和蓝光老化一致性非常好

应用领域

Mini LED背光

  • 产品性能
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  • 资料下载
Items Condition Unit Typical Value
Reflectivity A %
91
Tg
DMA

180
Td TGA (5% W.L) 374
T288
TMA min >60
T260 TMA min
>60
Thermal Stress
288℃, solder dipping
s >100
CTE (Z-axis) Before Tg ppm/℃ 26
After Tg ppm/℃ 125
50-260℃ % 1.9
CTE (X/Y-axis)
Wrap-α1
ppm/℃
11-13
Fill--α1
ppm/℃
11-13
Arc Resistance D-48/50+D-0.5/23 s 180
Dielectric Breakdown D-48/50+D-0.5/23 kV 45
Peel Strength (1oz) 288℃/10s N/mm[lb/in] 0.7[4.0]
Flexural Strength (LW/CW) A MPa 480/370
Water Absorption E-1/105+D-24/23 % 0.08
Flammability
C-48/23/50
Rating
HB

Remarks:

1. All the typical value is based onthe 1.0mm specimen.

2. All the typical value listed aboveis for your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.