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HDP User Group Asia Meeting 2012 hosted successfully by Sytech and NERCECBM


The 2012 Asia Members Meeting of HDPug was successfully held on 5th and 6th of December at Hyatt Regency Dongguan. The meeting was hosted by HDP User Group International Inc., and co-hosted by Shengyi Technologies(Technology Co., Ltd.) and National Engineering Research Center of Electronic Circuits Base Materials.

For the opening meeting on 5th of December, we invited some world’s famous end-users and PCB shops to the meeting, such as Celestica, Dow Corning, Emerson, Fiberhome, H3C, Huawei, IBM, IST, ZTE, Bomin, Founder, Kingbrother, Redboard, SCC, Suntak pcb, SYE, Topcb and TTM. Including Shengyi staff from Marketing, R&D and ME department, there were 150 peoples attended the on-the-spot meeting, and some professionlists attended the meeting via internet. The meeting was presided by Mr. Brian Smith from HDPug, and started with the introduction of HDPug, and Followed by the introduction of Sytech and National Engineering Research Center of Electronic Circuits Base Materials(NERCECBM) by Mr. Kevin Zhang on behalf of Sytech. Mr. Marshall Andrews, Executive Director of HDPug, gave a plaque for the sincere appreciation for the meeting organization by Sytech and NERCECBM. Mr. Kong Lingwen, CTO of SCC, was invited to introduce the technology trend of Chinese PCB and packaging substrate. Afterwards, the projects, such TSV, Electro-chemical Migration on PCBs, Package/PCB Warpage, BFR-PVC Free Cable and Thin Copper Stress Test have been presented at the meeting. The first-day meeting was ended with (a)plant tour at Shengyi Song Shan Lake Plant.

For the member’s meeting on 6th of December, more than 40 specialists from Celestica, Huawei, IBM TTM group and Sytech attended the meeting, on which the progress of 13 projects of HDPug have been reviewed.

HDP User Group Asia Meeting 2012 provided a communication platform on the HDPug’s projects for the members and non-members, and Sytech and NERCECBM were honored to host this meeting.