EN/CN

Product

SDI03K

Characteristic


● High Tg halogen free,Tg 185℃(DSC)

● Lower Z-axis CTE



Application Area

● Smartphone, notebook, tablet

● Instrument, VCR, TV

● Game station

● Communication equipment


  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 200
2.4.24
TMA 180
2.4.25D DSC
185
Td 2.4.24.6 5% wt. loss 390
T288
2.4.24.1 TMA min >60
T260 2.4.24.1
TMA min
>60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 240
50-260℃ % 2.3
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 3.44
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.0066
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 4.76×108
Surface Resistivity
2.5.17.1
C-96/35/90 1.84×107
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 181
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (H Oz)
2.4.8
288℃/10s
N/mm
1.1 [6.3]
Flexural Strength (LW/CW)
2.4.4
A MPa
595/547
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.07
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

1. All the typical value is based on the 1.0mm specimen, while the Tg is for specimen≥0.50mm, and the dielectric strength is based on other thickness specimen mentioned above.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.