EN/CN

Product

SML02G

Characteristic

● Lead free compatible

● High Tg halogen free,Tg 195℃(DMA)

● UV Blocking/AOI compatible

● Lower Z-axis CTE


Application Area

● Communication equipment

● Smartphone

● High performance computer

● Game station and etc.

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 195
Td 2.4.24.6 5% wt. loss 420
T288
2.4.24.1 TMA min 60
T260 2.4.24.1
TMA min
60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 40
After Tg ppm/℃ 210
50-260℃ % 2.3
Dissipation Constant 2.5.5.9 C-24/23/50, 1GHz - 4.8
Dissipation Factor
2.5.5.9
C-24/23/50, 1GHz - 0.013
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 1.98×107
Surface Resistivity
2.5.17.1
C-96/35/90 3.53×106
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 180
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) 2.4.8 288℃/10s N/mm 1.4
Flexural Strength (LW/CW) 2.4.4 A MPa 600/480
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.08
Flammability
UL94
C-48/23/50
Rating
V-0
RTI UL LTTA 150

Remarks:

1. All the typical values are based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm, and the dielectric strength is based on other thickness specimen mentioned above.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.