产品与市场
S1150GH
特点
● 耐CAF能力
● 无铅兼容
● 无卤、无锑和无红磷
● 较常规中Tg FR-4.1 更低的损耗
应用领域
智能手机，平板电脑，手提电脑，LED， 游戏基站网络终端内存，固态硬盘等- 产品性能
- 产品证书
- 资料下载
| Item0 | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 160 | |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% wt. loss) | ℃ | 390 | |
|
T288 |
IPC-TM-650 2.4.24.1 |
TMA | min | ＞60 | |
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | ＞60 | |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 | 288℃, solder dipping | s | ＞100 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | |
|
IPC-TM-650 2.4.24 |
After Tg | ppm/℃ | 190 | ||
|
IPC-TM-650 2.4.24 |
50-260℃ | % | 2.2 | ||
|
Dk |
1GHz |
IPC-TM-650 2.5.5.9 |
C-24/23/50 |
- | 4.05 |
|
(RC:56%) |
10GHz |
IPC-TM-650 2.5.5.5 |
C-24/23/50 |
- | 3.96 |
|
Df |
1GHz |
IPC-TM-650 2.5.5.9 |
C-24/23/50 | - | 0.007 |
|
(RC:56%) |
10GHz |
IPC-TM-650 2.5.5.5 |
C-24/23/50 | - | 0.008 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 6.0×108 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 8.0×107 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 148 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | 45+kV NB | |
| Peel Strength (1Oz) | IPC-TM-650 2.4.8 | 288℃/10s |
N/mm[lb/in] |
1.4[8.0] |
|
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 430 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.10 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
Remarks:
1. All the typical value is based on the 1.6mm (8*7628) specimen. Dk and Df value is based on 2116 RC56%.
2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., LTD for detailed information, and all right from this data sheet are reserved by Shengyi Technology Co., Ltd.