产品与市场
S7045GHU
特点
● 高Tg,180℃(DSC)
● 无卤
● 黑色,94-V0
应用领域
● 服务器、交换机、基站和线卡- 产品性能
- 产品证书
- 资料下载
Items | Method | Condition | Unit | Typical Value | |
---|---|---|---|---|---|
Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 190 | |
Tg |
IPC-TM-650 2.4.25D |
DSC |
℃ |
180 | |
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 415 | |
T288 |
IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃,solder dipping | -- | PASS | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | |
After Tg | ppm/℃ | 245 | |||
50-260℃ | % | 2.3 | |||
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.15 | |
IEC61189-2-721 SPDR |
10GHz |
-- | 4.43 | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.010 | |
IEC61189-2-721 SPDR |
10GHz |
-- | 0.0135 | ||
Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ·cm | 1.8E+07 | |
Surface Resistivity |
IPC-TM-650 2.6.17.1 |
C-96/35/90 |
MΩ |
3.8E+07 | |
Dielectric Breakdown |
IPC-TM-650 2.5.6 |
D-48/50+D-0.5/23 | kV | >45 | |
Peel Strength (1oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm | 0.95 | |
Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.12 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 (HF) |
Remarks:
All the typical value is based on the 0.76(6*2116)specimen,but not guarantee data. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.