CN/EN

产品与市场

SF325

特点

●优异的耐离子迁移性,不长枝状结晶。
●不含卤素,阻燃性达到UL94 V-0 级。
●优秀的挠曲性、耐热性、尺寸稳定性和电性能。
●满足RoHS 指令要求,不含铅、汞、镉、六价铬、
多溴联苯、多溴联苯醚等。

应用领域

电脑、移动电话、数码相机、医疗电子设备、汽车电子设备等。
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Items Method Condition Unit Typical Value
Peel Strength (90°) IPC-TM-650 2.4.9D Accepted N/mm 1.1
288℃, 5s 1.0
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - Pass
Dimensional Stability IPC-TM-650 2.2.4B After Etched
% ±0.1
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >90
Moisture Absorption     IPC-TM-650,No.2.6.2 C-24/23/50 % 1.43
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.5×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
1.5×106
Dielectric Constant (1GHz) SPDR C-24/23/50 - 3.25
Dissipation Factor (1GHz) SPDR C-24/23/50
- 0.012
Anti-ion Migration - C-1000/85/85,100VDC
- Pass
Flammability UL94 E-24/125 Rating V-0

Remarks:

All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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