产品与市场
DLF
特点
●较低的介电损耗，插损接近LCP
●优秀的耐热性、尺寸稳定性、耐化学性及电性能。
●不含卤素，阻燃性达到UL94 VTM-0级。
●满足RoHS指令要求，不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。
应用领域
高速电路用挠性印制板和刚挠性印制板
- 产品性能
- 产品证书
- 资料下载
|
Items |
Method |
Condition |
Unit |
Typical Value |
|
Peel Strength (90°) |
IPC-TM-650 2.4.9D |
Accepted |
N/mm |
0.86 |
|
288℃, 5s |
0.85 |
|||
|
Solder Resistance |
IPC-TM-650 2.4.13.F |
288℃, 10s |
- |
Pass |
|
Dimensional Stability |
IPC-TM-650 2.2.4B |
After Etched |
% |
MD:-0.0584 TD:-0.0639 |
|
Chemical Resistance |
IPC-TM-650 2.3.2G |
After Chemical Exposure |
% |
＞95 |
|
Moisture Absorption |
IPC-TM-650,No.2.6.2 |
C-24/23/50 |
% |
0.72 |
|
Volume Resistivity |
IPC-TM-650 2.5.17E |
C-96/35/90 |
MΩ-cm |
2.46×109 |
|
Surface Resistance |
IPC-TM-650 2.5.17E |
C-96/35/90 |
MΩ |
3.87×106 |
|
Dielectric Constant (1GHz) |
SPDR |
C-24/23/50 |
- |
3.4 |
|
Dissipation Factor (1GHz) |
SPDR |
C-24/23/50 |
- |
0.0033 |
|
Flammability |
UL94 |
E-24/125 |
Rating |
V-0 |