CN/EN

产品与市场

S7136H

特点

● 电子级玻璃纤维布增强无机陶瓷填料和碳氢类树脂复合介质材料
● 具有优异的低介电常数和介电损耗等高频性能
● 不同频率下稳定的介电性能

● 低的Z轴膨胀系数,优异的尺寸稳定性

应用领域

● 微带和蜂窝基站

● 功率放大器
● 天线
● LNA/LNB

● 高频无线通讯

卫星信号传输设备


  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Dielectric Constant
Process Dk
IPC-TM-650 2.5.5.5 [1] 10GHz/23℃ - 3.42±0.05
Dielectric Constant
Design Dk
Differential phase length test A - 3.61
Dielectric Constant ICE 61189-2-721 (SPDR) 10GHz/23℃ - 3.68±0.05
Loss Tangent IPC-TM-650 2.5.5.5 10GHz/23℃ - 0.0030
IEC 61189-2-721 (SPDR) 10GHz/23℃ - 0.0035
TcDk IEC 61189-2-721 10GHz (-40-150℃) ppm/℃ +50
Volume Resistivity IPC-TM-650 2.5.17.1 A MΩ·cm 1.1 x 108
Surface Resistivity
IPC-TM-650 2.5.17.1
A 1.6 x 107
Tg IPC-TM-650 2.4.25 DSC >280
Td ASTM D3850 TGA (5% W.L) 390
CTE (X/Y/Z-axis) IPC-TM-650 2.4.24 TMA (30-260℃) ppm/℃ 12/14/45
Peel Strength
IPC-TM-650 2.4.8 288℃/10s N/mm [ln/in] 0.72 [4.11]
Water Absorption IPC-TM-650 2.6.2.1 D-24/34 % 0.06
Thermal Conductivity ASTM D5470 100℃ W/m·K 0.66
Tensile Modulus (LW/CW) ASTM D638 A GPa
16.1/18.5
Tensile Strength (LW/CW) ASTM D638 A MPa 175/245
Flexural Strength IPC-TM-650 2.4.4 A MPa 260
Flammability
UL-94 C-48/23/50 Rating V-0

Remarks:

1. [1] For double-sided boards, S7136H (CH1) results in a thickness increase of approximately 0.0007'' (18μm) and the Dk decreases by about 0.1 as the core thickness decreases from 0.0207'' to 0.0107''.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Remarks: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning. The first digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.