Product
SF202C
Characteristic
● Excellentanti-ion-migration performance.
● Excellent thermal agingresistance
● Flammability UL94 VTM-0.
● Low Dk & Low Df at highfrequency
● Low adhesive flowing, good processability,suitable for both fast andtraditional lamination style.
● Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
For security, high reliability requirements of electronic products.
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.10 |
| 288℃、5s | 1.10 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - |
No delamination |
| Dimensional Stability |
SY Method |
After peeling off the paper |
% | 0.0270/0.0030 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞90 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
8×108 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
2×105 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 3.2 |
| Dissipation Factor(10GHz) | SPDR |
C-24/23/50 |
- | 0.008 |
| Flammability | UL94 |
E-24/125 |
Rating |
V-0 |
Remarks:
All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd.