Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25D	DSC	℃	190
		IPC-TM-650 2.4.24	TMA	℃	180
		IPC-TM-650 2.4.24.4	DMA	℃	200
Td		IPC-TM-650 2.4.24.6	TGA(5% wt. loss)	℃	408
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	35
			After Tg	ppm/℃	180
			50-260℃	%	1.8
CTE (X/Y-axis)		IPC-TM-650 2.4.25	Before Tg	ppm/℃	11/13
T260 (With Cu)		IPC-TM-650 2.4.24.1	TMA	min	>60
T288 (With Cu)		IPC-TM-650 2.4.24.1	TMA	min	>60
Thermal Stress		IPC-TM-650 2.4.13.1	288℃/10s/6cycles, solder dip	-	Pass
Volume Resistivity		IPC-TM-650 2.5.17.1	C-96/35/90	MΩ.cm	6.0 x 108
Surface Resistivity		IPC-TM-650 2.5.17.1	C-96/35/90	MΩ	8.0 x 107
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	181
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	45+KV NB
Dissipation Constant (Dk) RC52%		IPC-TM-650 2.5.5.9	1GHz	--	4.3
Dissipation Factor (Df) RC52%		IPC-TM-650 2.5.5.9	1GHz	--	0.011
Peel Strength (1Oz HTE copper foil)		IPC-TM-650 2.4.8	288℃/10s	N/mm	1.3
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	560
	CW	IPC-TM-650 2.4.4	A	MPa	450
Water Absorption		IPC-TM-650 2.6.2.1	D-24/23	%	0.11
Flammability		UL94	C-48/23/50	Rating	V-0

Remarks:

1. All the typical value is based on the 1.6mm(8*7628) specimen. The Dk and Df value is based on 50% RC.
2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights fromthis data sheet are reserved by Shengyi Technology Co., Ltd.