Product
DLF
Characteristic
●Low dissipation loss approach to LCP
●Excellent solderingreliability,dimensional stability, chemical resistance and electricalproperties.
●Halogen free, flammabilityUL94 VTM-0.
●Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
Be used in high frequency multi-layer FPC and rigid-flexPCB as the bonding lay
- Product Performance
- Product Certificate
- Data Download
|
Items |
Method |
Condition |
Unit |
Typical Value |
|
Peel Strength (90°) |
IPC-TM-650 2.4.9D |
Accepted |
N/mm |
0.86 |
|
288℃, 5s |
0.85 |
|||
|
Solder Resistance |
IPC-TM-650 2.4.13.F |
288℃, 10s |
- |
Pass |
|
Dimensional Stability |
IPC-TM-650 2.2.4B |
After Etched |
% |
MD:-0.0584 TD:-0.0639 |
|
Chemical Resistance |
IPC-TM-650 2.3.2G |
After Chemical Exposure |
% |
＞95 |
|
Moisture Absorption |
IPC-TM-650,No.2.6.2 |
C-24/23/50 |
% |
0.72 |
|
Volume Resistivity |
IPC-TM-650 2.5.17E |
C-96/35/90 |
MΩ-cm |
2.46×109 |
|
Surface Resistance |
IPC-TM-650 2.5.17E |
C-96/35/90 |
MΩ |
3.87×106 |
|
Dielectric Constant (1GHz) |
SPDR |
C-24/23/50 |
- |
3.4 |
|
Dissipation Factor (1GHz) |
SPDR |
C-24/23/50 |
- |
0.0033 |
|
Flammability |
UL94 |
E-24/125 |
Rating |
V-0 |