● Tg 200℃
● Dk/Df@10GHz: 3.66/0.0060
● Td>380℃, T300>60min

● low Z-axis CTE with good processibility

● Low moisture absorption and excellent thermal reliability

● Lead-free Compatible

Application Area

● Networking equipment (Routers, servers, switches)

● High performance computers

● Base Station backplane, line card

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg IPC-TM-650
Td IPC-TM-650 5% wt. loss 383
CTE(Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 210
50-260℃ % 2.6
T288 IPC-TM-650 TMA min 120
T300 IPC-TM-650 TMA min 60

Dissipation Constant (Dk)

RC 55%

IPC-TM-650 1GHz -- 3.85
IPC-TM-650 10GHz -- 3.66
IEC 61189-2-721
10GHz -- 4.05

Dissipation Factor (Df)

RC 55%

IPC-TM-650 1GHz -- 0.0045
IPC-TM-650 10GHz -- 0.0060
IEC 61189-2-721
10GHz -- 0.0068
Peel Strength (1Oz RTF copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 0.95 [5.43]
125℃ N/mm
Water Absorption IPC-TM-650 E-1/105+D-24/23 % 0.09
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0


1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.