●Low transparence, excellentlight-blocking.

●Flammability UL94 V-0.

●Excellent solderingreliability, chemical resistance and electrical properties.

●Low adhesive flowing, good processability,suitable for both fast and traditional lamination style.

●Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..

Application Area

Coverlayfor FPC.

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 0.71
288℃, 5s 0.7
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability SY Method After peeling off the paper
% -0.0304/-0.0151
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >85
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.1×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
Dielectric Constant (10GHz) SPDR C-24/23/50 - 4.22
Dissipation Factor (10GMHz) SPDR C-24/23/50
- 0.0405
Resin Flow IPC-TM-650 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125
Rating V-0


* Certified to IPC-4203/2 Epoxy adhesive on one or two sidesof poyimide dielectric