●Halogen free and phosphorusfree, UL94 V-0.

●High bonding strength, gooddimensional stability

●Excellent solderingreliability, chemical resistance  andelectrical properties.

●Low adhesive flowing, good processability,suitable for both fast and traditional lamination style.

●Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..

Application Area

Coverlayfor FPC.

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 1.13
288℃, 5s 1.17
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability SY Method After peeling off the paper
% 0.0313/0.0415
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >90
Electric Strength IPC-TM-650 D-48/50+D-0.5/23 KV/mm 105
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 2.0×106
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.27
Dissipation Factor (10GHz) SPDR C-24/23/50
- 0.019
Resin Flow IPC-TM-650 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125 Rating V-0


* Certified toIPC-4203/2 Epoxy adhesive on one or two sides of poyimide dielectric andShengyi standard.