EN/CN

Product

Synamic 6B(F)

Characteristic

●  High Tg and high Td

●  Tailored Dk 3.5 bonding prepreg for RF multilayer

    no need for high temperature lamination and extra-long curing

●  Good resin flow

●  UL94 V-0 flame rating

Application Area

● Cellular base station antennas

● Antenna feed networks

● Telemetry

DAS & CPE antenna

● Massive MIMO antenna




  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 210
2.4.25D DSC
190
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min >120
T300 2.4.24.1
TMA min
>60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 56
After Tg ppm/℃ 232
50-260℃ % 2.0
Dissipation Constant
2.5.5.9 
C-24/23/50,1GHz
- 3.54
2.5.5.5 
C-24/23/50,10GHz
- 3.56
IEC61189-2-721
C-24/23/50,10GHz
- 3.87
Dissipation Factor 
2.5.5.9
C-24/23/50,1GHz
- 0.0013
2.5.5.5
C-24/23/50,10GHz
- 0.0036
IEC61189-2-721
C-24/23/50,10GHz
- 0.0046
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm [lb/in] 0.85 [4.86]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.09
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

1. All the typical value is based on the 0.714mm (7*3313 RC55%) thickness specimen, but not guarantee data.

2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in  and the third digit the relative humidity.

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