EN/CN

Product

SG7350D2

Characteristic

● Glass-reinforced PTFE and ceramic dielectric.

●  Excellent high frequency performance.

●  Enhanced thermal conductivity.

●  Stable electrical propertiesversus frequency.

●  Low Z-axis expansion andexcellent dimensional stability.

●Compatible with lead-free process

Application Area

Passive Components

Power Amplifiers.

Microwave Combiner and Power Dividers

LNA/LNB

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Process Dk IPC-TM-650 2.5.5.5 [1] 10GHz/23℃ - 3.50
Process Df IPC-TM-650 2.5.5.5 [1] 10GHz/23℃ - 0.0019
TcDk IPC-TM-650 2.5.5.5 -25°C to 125°C ppm/°C -15
Volume Resistivity IPC-TM-650 2.5.17.1 A MΩ·cm 5.1 x 107
Surface Resistivity
IPC-TM-650 2.5.17.1
A 2.5 x 107
Electrical Strength
IPC-TM-650 2.5.6.2
A KV/mm

Dielectric Breakdown
IPC TM-650 2.5.6
A kV

Td ASTM D3850 TGA (5% W.L) 560
CTE (X/Y/Z-axis) IPC-TM-650 2.4.24 TMA (30-260℃) ppm/℃ 11/10/26
Peel Strength
IPC-TM-650 2.4.8

after solder float

1oz. ED Foil
N/mm [ln/in] 0.95 [5.43]
Water Absorption IPC-TM-650 2.6.2.1 D-24/34 % 0.05
Thermal Conductivity ASTM D5470 100℃ W/m·K 1.23
Flexural Strength (X/Y-axis) IPC-TM-650 2.4.4 A MPa 90/78
Flammability
UL-94 C-48/23/50 Rating V-0

Remarks:

(1) Allthe typical value is based on the 0.508mm(0.020”) specimen, and thespecification sheet is based on IPC4103.

(2) Typicalvalues are a representation of an average valuefor the population of the property.