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Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials
- 广东生益
- 苏州生益
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- 陕西生益
- 江苏生益
- 江西生益
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- Environmental Material
- Extremely low-loss
- 环保材料
- HDI
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
- 其它
- 超低介质损耗
- 低介质损耗
- 叠层母排用绝缘胶膜
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- 热固性树脂体系
- 硬质聚酰亚胺材料
- 半挠性材料
- 特种粘合材料
- 中等介质损耗
- 铝基板
- 铜基板
- 挠性覆铜板
- 覆盖膜
- 胶膜
- 补强板
- 常规FR-4.0
- 无铅兼容FR-4.0, FR-15.0
- 无卤无铅兼容FR-4.1, FR-15.1
- IC Substrate
- 涂树脂铜箔
- 碳氢系列产品
- 导热FR-4.0
- 汽车产品
- 智能终端产品
- 常规刚性产品
- 汽车产品
- 射频与微波材料
- 金属基板与高导热产品
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- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- 台湾
- 东莞
- 苏州
- 咸阳
- 韩国
- 欧洲
- 美国中北大道
- 美国森林大道
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- 巴西
- 东莞万江
- 咸阳
- 苏州
- 常熟
- 南通
- 九江
- 研发及工程化对外业务
- 委托测试对外业务
- 知识产权和标准对外业务
- 人才培养和技术培训
- CQC Certificate
- BSI Certificate
- JET Certificate
- VDE Certificate
- UL File (UL IQ link)
- Education
- Environmental Protection
- Society
- Shengyi Technology
- Shaanxi Shengyi
- Suzhou Shengyi
- Changshu Shengyi
- Jiangsu Shengyi
- Jiangxi Shengyi
- Hong Kong Shengyi
- Taiwan Shengyi
- 资教助学
- 环安活动
- 回馈社会
- 广东生益
- 陕西生益
- 苏州生益
- 常熟生益
- 江苏生益
- 江西生益
- 香港生益
- 台湾生益
- 台湾
- PTFE Type
- 热固性树脂体系
- 硬质聚酰亚胺材料
- 半挠性材料
- 特种粘合材料
- 中等介质损耗
- 低介质损耗
- 超低介质损耗
- 挠性覆铜板
- 覆盖膜
- 不流动P片
- 胶膜
- 补强板
- 叠层母排用绝缘胶膜
- 东莞
- 苏州
- 咸阳
- 韩国
- 欧洲
- 美国中北大道
- 美国森林大道
- 日本
- 东莞万江
- 咸阳
- 苏州
- 常熟
- 南通
- 九江
- 东南亚
- 巴西
- 常规FR-4.0
- 无铅兼容FR-4.0, FR-15.0
- 无卤无铅兼容FR-4.1, FR-15.1
- CEM-1
- CEM-3, CEM-3.1
- IC Substrate
- 涂树脂铜箔
- 碳氢系列产品
- 铝基板
- 铜基板
- 导热FR-4.0
- 其它
- UL档案
- UL认证（查询）
- CQC认证
- BSI认证
- JET认证
- VDE认证
- 三会规则
- 工作制度
- 内部控制
- 研发及工程化对外业务
- 委托测试对外业务
- 知识产权和标准对外业务
- 人才培养和技术培训
- 联系方式
- 汽车产品
- Environmental Material
- Extremely low-loss
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- SF202C
- High solder resistance polyimide film based coverlay
- --
- --
- 0.0135
- 3.43
- Medical Instrument
- --
- --
- --
- --
- --
- SF206C
- Low Dk/Df polyimide film based coverlay
- --
- --
- 0.0091
- 3.11
- 5G
- --
- --
- --
- --
- --
- SF305C
- Halogen-free flame-resistant type PI film based coverlay
- --
- --
- 0.017
- 3.3
- Power battery protection board CCM Module Battery Module Antenna Module FPM Module LCD Module Light-Bar Module TP Module Vehicle-mounted Module
- --
- --
- --
- --
- --
- SF315C
- Flame-resistant type black polyimide film based coverlay
- --
- --
- 0.017
- 3.5
- WPC Light-Bar Module
- --
- --
- --
- --
- --
- SF325C
- Anti-ion Migration type PI film base coverlay
- --
- --
- 0.017
- 3.4
- COF Module
- --
- --
- --
- --
- --
- SF206B
- LowDk/Df Bonding film
- --
- --
- 0.003
- 2.5
- 5G
- --
- --
- --
- --
- --
- SF315B
- Halogen-free type epoxy bonding film
- --
- --
- 0.02
- 3.4
- Multilayer Module Rigid-Flex Module
- --
- --
- --
- --
- --
- SP168GN
- No-flow, Dust free prepreg
- --
- --
- 0.015
- 3.75
- CCM Module Multilayer Module Rigid-Flex Module
- --
- --
- --
- --
- --
- BIF201
- Halogen-free white insulation bonding sheet for PET laminated busbar
- --
- --
- 0.02
- 3.5
- --
- --
- --
- 135
- 310
- BIF202
- Halogen-free insulation bonding sheet for PET laminated busbar
- --
- --
- 0.02
- 3.5
- --
- --
- 3.50%
- 135
- 310