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Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials
- Environmental Material
- Extremely low-loss
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- S1150GH
- (UL ANSI: FR4.1) Halogen-free, Mid-Loss PCB Used Multilayer Material
- --
- --
- 0.008
- 3.96
- --
- --
- --
- 160
- 390
- S1150G
- Halogen free, mid-Tg material
- --
- --
- --
- --
- --
- --
- 2.8%
- 155
- 355
- S1170G
- Halogen free, high Tg，FR-15.1
- --
- --
- --
- --
- --
- --
- 2.3%
- 180 (DMA)
- 390